hall ics 1 publication date: january 2002 spc00010beb DN8797SE 3 v hall ic one-way magnetic field operation overview the DN8797SE is a 3 v operation hall ic which includes a hall element, amplifier circuit, schmidt circuit, stabilized power supply and temperature compensation cir- cuit which are integrated on a single chip with a fine pat- terning technology. the magnetic input signal is output- ted by being converted to high or low. we have improved the conventional circuit to realize a stable operation cov- ering from low to high supply voltage and from low to high temperature. features ? wide operating supply voltage range (v cc = 2.7 v to 16.0 v) ? wide operating ambient temperature ( ? 40 c to + 85 c) ? package: sip 3-pins ? equipped with an output pull-up resistor (typical 56 k ? ) applications ? dc brushless motor, fan motor, rotation sensor, detec- tion of cover open/close (example for a cellular phone), position sensor block diagram unit: mm ssip003-p-0000c 1 v cc 3 out 2 gnd 56 k ? (typ.) constant voltage source hall element amplifier comparator 4.520.3 0.550.15 0.40.1 1.540.1 1.27 123 (0.4) 12.506.5 (0.72) 4.520.3 (1.0) (1.0) note) the package of this product will be changed to lead-free type (ssip003-p-0000j). see the new package dimensions section later of this datasheet. maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://panasonic.net/sc/en
DN8797SE 2 spc00010beb note) 1. symbol b h-l stands for the operating magnetic flux density where its output level varies from high to low. 2. symbol b l-h stands for the operating magnetic flux density where its output level varies from low to high. 3. the variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power source. (v cc should be confined to the range of 2.7 v to 16.0 v.) 4. a supply current changes by maximum 1 ma when its output level varies from high to low. recommended operating range parameter symbol range unit supply voltage v cc 2.7 to 16.0 v absolute maximum ratings parameter symbol rating unit supply voltage v cc 18 v output voltage v out 18 v supply current i cc ma power dissipation p d 250 mw operating ambient temperature t opr 40 to 100 c storage temperature t stg 55 to 125 c note) 1. except for the operating ambient temperature and storage temperature, all ratings are for t a 25 c. 2. the reverse insertion of this ic will cause its breakdown. 3. it will operate normally in several tens of ms after power on. 4. this ic is not suitable for car electrical equipment. electrical characteristics at t a 25 c parameter symbol conditions min typ max unit operating magnetic flux density 1 b h-l v cc 3 v 20 mt operating magnetic flux density 2 b l-h v cc 3 v 3 mt hysteresis width bw v cc 3 v 0.2 1.5 4.0 mt output voltage 1 v ol1 v cc 16.0 v, i o 5 ma, b 20 mt 0.07 0.30 v output voltage 2 v ol2 v cc 2.7 v, i o 5 ma, b 20 mt 0.07 0.30 v output voltage 3 v oh1 v cc 16.0 v, i o 20 a, b 3 mt 14.4 14.9 15.4 v output voltage 4 v oh2 v cc 2.7 v, i o 20 a, b 3 mt 1.05 1.55 2.05 v output short-circuit current i os v cc 16.0 v, b 3 mt, v o 0 v 0.19 1.27 0.39 ma supply current 1 i cc1 v cc 16.0 v, b 3 mt 1.0 3.5 6.0 ma supply current 2 i cc2 v cc 2.7 v, b 3 mt 1.0 2.5 6.0 ma pin descriptions pin no. symbol description 1v cc supply voltage pin 2 gnd ground pin 3 out output pin
DN8797SE 3 spc00010beb technical data position of a hall element (unit in mm) distance from a package surface to sensor part: 0.42 mm magneto-electro conversion characteristics s n direction of applied magnetic field bw b h-l b l-h applied magnetic flux density b output voltage 2.26 2.13 2.26 1.75 caution on use of hall ics the hall ics are often used to detect movement. in such cases, the position of the hall ic may be changed by exposition to shock or vibration over a long period of time, and it causes the detection level change. to prevent this, fix the package with adhesives or fix it on a dedicated case. 1. a case using an adhesive some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. this corrosive gas corrodes the aluminum on the surface of the hall ic, and may cause a functional defect of disconnection. if hall ic is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals and substrate cleaner, as well as to the adhesive used for hall ic installation. please confirm the above matter to those manufacturers before using. we could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive. 2. a case bending lead wire bend the lead wire without stressing the package. fixed w fixed correct (a) (b) fixed bending method of lead wire bending position of lead wire w w 3 mm * 3 mm * * : the distance can be within 3 mm, if no stress is applied to the resin mold by tightly fixing the lead wires with a metallic mold or the like. wrong correct wrong correct wrong wrong
DN8797SE 4 spc00010beb caution on use of hall ics (continued) 3. power supply line/power transmission line if a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line. in this case, set the capacitor of 0.1 f to 10 f near the hall ic to prevent it. if a voltage of 18 v or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition pulse, etc.), avoid it with external components (capacitor, resistor, zener diode, diode, surge absorbing ele- ments, etc.). 4. v cc and gnd do not reverse v cc and gnd. if the v cc and gnd pins are reversely connected, this ic will be destroyed. if the ic gnd-pin voltage is set higher than other pin voltage, the ic configuration will become the same as a forward biased diode. therefore, it will turn on at the diode forward voltage (approximately 0.7 v), and a large current will flow through the ic, ending up in its destruction. (this is common to monolithic ic.) 5. cautions on power-on of hall ic when a hall ic is turned on, the position of the magnet or looseness may change the output of a hall ic, and a pulse may be generated. therefore, care should be given whenever the output state of a hall ic is critical when the supply power is on. 6. fixing a hall ic when the hall ic of an insertion type package installed by soldering the lead wire only is to be used under vibration, fix it firmly with a holder. otherwise, vibration may cause metal fatigue in the lead wire of hall ic, resulting in wire breakage. 7. on fixing a hall ic to holder when a hall ic is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder is large, the lead wire of the hall ic will be stretched and it may give a stress to the hall ic. if the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture. sensitivity may also be changed by this stress. 8. on using flux in soldering choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. the ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the disconnection of the aluminum wiring on the surface of an ic chip. 9. in case of the magnetic field of a magnet is too strong output may be inverted when applying a magnetic flux density of 100 mt or more. accordingly, magnetic flux density should be used within the range of 100 mt. 10. on mounting , deburring and soldering of insertion type package if the leads of a hall ic in an insertion type package are inserted up to their root part through holes on the printed circuit board, abnormal stress is applied to the package and the reliability of the hall ic is likely to deteriorate. so, when mounting each hall ic of the insertion type, insert the leads in due degree at which the bottom face of the package is separated at least 2 mm from the top face of the pcb. also note that burrs of epoxy resin may be left sticking to the lead wires. (we are trying to remove such burrs as much as possible in the deburring process, but in some cases, they are not perfectly removable.) 2 mm printed board remaining burrs when soldering the leads, remenber to separate the soldering position by 2 mm or more from the resin part of the package.
DN8797SE 5 spc00010beb new package dimensions (unit: mm) ssip003-p-0000j (lead-free package) (1.00) (1.00) (0.72) 13 4.52 0.20 0.55 0.15 4.52 0.20 0.40 0.10 1.54 0.10 12.50 0.65 0.40 +0.10 - 0.05 1.27 1.27
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